PCB Design Advantages
Professional Design Team
More than 100 design engineers;
Average design experiences 6 years;
37% design engineers more than 10 years;
92% Bachelor
High design quality process
Strict design review system;
Strict quality system process;
Zero error rate quality requirements;
Leading the design experience of advanced technology
well-known Telecom company（HW) design experiences;
familiar with High speed design more than 10G;
familiar with High Voltage design;
familiar with High density board design;
familiar with EMC design.
High-difficulty design
More than 90000pin design experience;
HDI/Any layer PCB design;
3D PCB design;
RF design;
56G high-speed design;
5G relative product design;
INTEL reference design.
Design Capability
1The Maximum design scale： 90000pin+
2The Maximum BGA number: 100+
3The Minimum VIA：4mil
4The Maximum BGA Pin number：3647 pin
1The Maximum design layers： 42 layers
2The Minimum width of traces: 1.9mil
3The Minimum pitch of BGA：0.3MM
4The Highest speed signal：56G
The design experiences of silicon
Processor
Intel: Purley Haswell platform Ivy Bridge and Sandy Bridge Series
Shark Bay Mobile Platform
Marvell: PXA920/920H Series Xelerated series
ARM ADA1000/1500 98CX8129/8297
Qualcomm/SPRD/MTK Mobile: MSM86XX / 82XX / 76XX
SC9610 / 8810 / 6820 MT6573 / 6575 / 6577/ 6589
Freescale PowerPC Series: MPC8541 / 8548 / 8555 / 8641 P2020
TI: AM35X / 38X OMAP4430 / P3505 66AK2EX C667X TMX320C
ADI: TS101/201 ADUCM3027/3029
FPGA/CPLD
Xilinx: Spartan-6 Spartan®-6 Artix-7 Kintex-7 Virtex- 7 Virtex-ultrascale
Virtex5 Zynq-7
Altera: Stratix Series Arria Series Cyclone series MAX Series
Cavium: CN7XXX CN6XXX NITROX III NITROX PX CN50XX
Lattice: MachX03 Series MachX02 Series
memory
Samsung: DDR4 DDR3 DDR2
Hynix: DDR4 DDR3 DDR2
Elpida: DDR3 DDR2
Mircon: DDR4 DDR2 DDR3
Mircon: DDR4 DDR2 DDR3
Cypress: CY7C1510 CY7C1565 CY7C25XXB
PCB design process
