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PCB Manufacture

who we are

Single Sided

Plated Through Hole

Multi-Layer (Up to 40 Layers) including buried and blind Via’s

  Multi-Layer with bonded heat sinks

  Flexible PCB

  Flex-Rigid PCB

our advantage

High Temperature (Polyimide)

Microwave (PTFE)

Copper Invar Construction

Special Gold for ‘Chip on Board’

Controlled Impedance

Aluminium Clad Technologies

why choose us

Fast/Quick Turn PCB Prototyping

Good quality

DFM simulation





LINKYTECH TECHNOLOGY

Design、PCB FAB、SMT、Purchasing、Test 、Turn-key Solution



PCB capability
Proto-typingMass-product
  Layer2-64L2-58L
Thickness0.5-17.5mm0.6-10mm
Min Mechanical0.1mm0.2mm
Min Laser Hole 3mil4mil
HDI1+n+1\2+n+2\3+n+31+n+1\2+n+2\3+n+3
Min Width/Space3/3mil3.5mil/3.5mi
Layer2-64L2-58L
thickness0.5-17.5mm0.6-10mm
Min Mechanical0.1mm0.2mm
Min Laser Hole 3mil4mil
HDI1+n+1\2+n+2\3+n+31+n+1\2+n+2\3+n+3
Min Width/Space3/3mil3.5mil/3.5mi



Lead Time
LayerMass productionPrototypeQuick Turn
2L10days5days3days
4L12days6days3days
6L12days7days4days
8L14days10days4days
10L14days10days5days
12L16days12days6days
14L16days12days6days
16L18days14days6days
18L18days14days10days
20L20days14days10days
22L 20days14days10days
24L20days14days 10days
26L20days5days 3days
This is the time after the confirmation of the project